WSD
RF SoC interaction with peripherals and the demand for attention to coupling effects in early design phases
Time : Sunday, June 15th, 8am-5pm
Topics and Speakers:
- Cross coupling in Baseband-Radio SoCs - Dr. Dietolf Seippel (Infineon Technologies)
- Parasitic-aware Design Methodology for Wireless SoC - Dr. Robert A. Mullen (Cadence)
- Post-Silicon and Pre-Silicon Techniques for Mitigating the Effects of Interference in Wireless SoCs - Oren Eliezer (Texas Instruments)
- Advanced EM simulation technology for RF SoC modeling - Dr. Jan Vanhese (Agilent)
- Noise Coupling in RF and mixed-signal Circuits: Modeling and Experimental Validation - Dr. Geert van der Plas (IMEC)
- Electrical Signal Integrity Analysis in Mixed-Signal and RF ICs - Dr. Francois Clement (S.A. CWS)
- RF SoC coupling effects and interaction with peripherals: needs to be dealt with in the early design phases! - Dr. Jan Niehof (NXP Semiconductors)
- Isolation Issues in Multi Chip Radio Modules for Cellular Applications: On Chip, Module-Chip and in Module - Jyoti Mondal (Freescale Semiconductor)
Organizers:
Dr. Jan Niehof (NXP Semiconductors)
Oren Eytan Eliezer (Texas Instruments)
Sponsors: RFIC
Workshop Abstract:
This workshop will focus on the key requirements to address physical design issues in the early design phases of complex RF SoC design. The workshop will be divided into two sessions. The morning session will focus on the requirement specification related to the SoC physical design, including tool and flow requirements. Recognized companies and partnerships active in the semiconductor industry will give these presentations and explain their needs through actual examples. In the afternoon session, EDA vendors will give presentations to react on the customer requirements. They will present the future direction and CAD/EDA roadmaps to address these issues. |
