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2007 IEEE RFIC Symposium
panel session information

 

Monday
12:00-13:15 PMA HCC - 313C


RFID: New Revolution or Remarketing of Existing Technologies in a New Package?

Moderator: Sayfe Kiaei, Arizona State University

Panelists: Reza Rofougaran, Broadcom Inc.; Ganesh K. Balachandran, Texas Instruments; Mitsuo Usami, Hitachi, Ltd.; Frank Mau-Chung Chang, UCLA; Robert Plana, LAASCNRS; Issy. Kipnis, Intel; Scott Chiu, Intel; John Adams, Freescale Inc.

Sponsor: RFIC

This panel will focus on the development, architecture, applications, security, and system-level issues of RFIDs. New RFID technologies have the potential to revolutionize business processes and help create innovative end-user applications.This panel will discuss the future of RFID technologies and the potential impacts of this technology:

  • What is unique and new in RFID?
  • What is different from ZIGBEE and other 802.11 low-power solutions?
  • Will it take the Bluetooth path?
  • Is it a marketing hype or a reality?
  • What are the RF-design challenges here?
TUESDAY
12:00-13:15 PTUA HCC - 313C


CMOS Millimeter-Wave MMIC: Real or Bubble?

Moderator: Hiroshi Kondoh, Hitachi Ltd.

Panelists: Sorin Voinigescu, University of Toronto; Rudolf Lachner, Infineon Technology; Huei Wang, National Taiwan University; Kenjiro Nishikawa, NTT; Tuneo Tokumitsu, Eudyna Devices; Herbert Zirath, Chalmers Univ. of Technology; AliM. Niknejad, UC Berkeley

Sponsor: RFIC

CMOS would be the most promising device for millimeter applications. But, when will the millimeter-wave CMOS IC be a real product? What kinds of applications are expected? The panel will discuss the pros and cons of CMOS and other devices, and will show these technical tends/market forecast.

TUESDAY
12:00-13:15 PTUB HCC - 316C


Your GaAs Foundry and the Future: Anyone Have Issues? Of Course!

Moderators:

  • Brad Nelson, Sirenza Microdevices
  • Paul Blount, Custom MMIC Design Services

Panelists: Wing Yau, Global Communication Semiconductor; Bob Donahue, Win Semiconductor; Phillipe Labasse, United Monolithic Semiconductors; Mike Peters, TriQuint Semiconductor; Marc Rocchi, Ommic; David Smith, Filtronic

Sponsor: IMS

Come ask the foundries how they plan to solve your problems. This panel session will address key issues facing GaAs foundries and their customers today and in the future: performance, reducing cost, quality control, emerging markets, second sourcing, consolidation, disruptive technologies.

WEDNESDAY’S PANELS
12:00-13:15 PWA HCC - 313C


Is GaN Ready for Prime Time?

Moderator: Mark Rosker, DARPA

12:00-13:15 PWB HCC - 316C


Will RF-MEMS Make the Commercial Leap?

Moderators:

  • Scott Barker, University of Virginia
  • Gabriel Rebeiz, University of California San Diego

12:00-13:15 PWC HCC - 317A


Grant Opportunities at the National Science Foundation

Moderators:

  • Leda Lunaradi, NSF
  • Don Senich, NSF
THURSDAY’S PANELS
10:10 - 11:50 PTHA HCC - 317A


Career Development: Giving Your Career A Never-Ending Boost

Moderators:

  • S. Pacheco, Freescale Semiconductor
  • R. Henderson, Freescale Semiconductor
12:00 - 13:15 PTHB HCC - 313C


THz Electronics for the 21st Century

Moderator: Richard Lai, NGST

12:00–13:15 PTHC HCC - 316C


RF Techniques for Signal Integrity Engineering

Moderator: Ashok Bindra, RF Design Editor

 

 


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Qualcomm

See here for Sposorship Details

Workshop Proposal Due
15 Sept, 2006

Paper Submission Due
10 Jan, 2007

Program book, conference and hotel registration open
Early March, 2007

Final Manuscript Due
5 March, 2007

RFIC 2007
3-5 June, 2007

Weather in Honolulu

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