WSD
MULTI-CHIP RADIO MODULE (MCRM)
DESIGN METHODOLOGY AND TOOLS AND MANUFACTURING
ISSUES FOR CELLULAR APPLICATIONS

Date & Time: Sunday, June 11; 8:00 AM to 5:00 PM

Location: Moscone Convention Center, TBD

Topics & Speakers:

• A Complete Wireless Design Flow Enabling Design Productivity, Juergen Hartung, Cadence
• Multi-Chip Radio Module Design for Handsets, Chris Mueth, Agilent Technologies
• Wireless Module Design: Multi-medium Concurrent Engineering of System, Circuit and Layout Using the AWR Design Environment, M. Heimlich, AWR
• Electromagnetic Simulation of Passive Components for RF Module Design Using Ansoft Simulation Tools Integrated to Layout, Matt Commens, Ansoft
• Precision Electromagnetic Analysis in a Multi-Chip Environment, Jim Rautio, Sonnet
• Successful Simulation Approaches for RF Module Design, Scott Wedge, Synopsys
• RF Module Design Methodology, Jyoti Mondal, Freescale Semiconductors
• Design and Verification for RF Systems Methodology, Flow and Simulation, Martin Barnasconi and Jan Niehof, Philips Semiconductor
• Challenge and Methodology for Cellular Applications, System and IC Co-Design, Kyutae Lim, Georgia Institute of Technology
• RF Module Assembly for Wireless Communication Applications, Jae-Sun An, ASE Korea
• RF Module Assembly and Technology Integration, Eric Gongora and Robert Frye, STATSChipPAC
• Critical RF Module Assembly Rules, Ted Adlam, AMKOR
• Surface Finish and Maintaining 3 Sigma Design Tolerances on Critical Parameters for High Yield Radio Module Fabrication, Gary Hung, Unimicron

Organizers:

Jyoti Prakash Mondal, Freescale
Jan Niehof, Philips Research Lab
Didier Belot, ST Microelectronics

Sponsors: MTT-23 RFIC

MultiChip Radio Modules (MCRM) are becoming omnipresent parts in any handset for wireless and cellular applications. MCRM operates mostly in mixed signal environments and serves multiple functions. For example, an MCRM with DIGRF interface not only has transceiver function, it does the necessary control functions for power amplifier module as well as provides digital interface for the base band module. It saves space on board and lowers component counts. To customers, it is equivalent to lower cost and smaller size for cellular handsets. Presently three main modules (MCRM, PA and Base Band) cover all the necessary electrical functions in a cellular handset. Future MCRMs are likely to integrate more functions like PA. Designing low cost MCRM in ever shrinking size poses formidable challenges. Material properties and process tolerances need to be well defined. Keeping proper electrical isolation between various signals becomes quite messy. Tools to predict various coupling mechanisms need to be accurate. On top of it the modules need to be mechanically robust and RoHS compliant under various stress conditions. This also adds further constraint to the size and electrical performance of the module. This workshop will be divided into two sessions. The morning session will present a comprehensive tool set that is currently available to design MCRM. Goal is top system level module simulation with various chips inside. Not all the available tools will be discussed due to time constraint. Audience is welcome to discuss more. The afternoon session will have presentations from module design community, module substrate vendors, manufacturers and assembly houses; that will address various technology options (wire bond and flip chip), signal isolation issues, material properties, IC-substrate interface etc. Objective is to address the main issues and solutions for designing MCRMs, starting from design tools, SiP, SoC verification, design methodology to finished MCRM product. It is a vast topic. This workshop will capture at least some of the main challenges and proposed solutions.