SoC vs. SiP: Dollars & Sense!!

Organizers & Moderators:

Fazal Ali, QUALCOMM
Mike Golio, HVVi

Date:

Tuesday June 13, 2006
12:00 - 1:20pm

Venue:

San Francisco Convention Center
Room - TBD

Panel Members:

Bill Krenik - Texas Instruments Patrice Gamand - Philips
Andreia Cathelin - ST Microelectronics Aravind Loke - Skyworks
Jeanne Pavio - Rockwell Collins Participant - AMKOR

Sponsor: MTT-23 RFIC

Abstract:

Recent years have seen dramatic miniaturization in the implementation of radio, microprocessor, memory and signal processing functions on mobile handsets. This increase in levels of integration is driven by the reduction in size, weight and cost as well as improvements in reliability realized in the resulting integrated radio. But these advantages are accompanied by engineering challenges related to all aspects of design, manufacturing and test.

Two distinct approaches: System on a Chip (SoC) and System in a Package (SiP) have evolved in addressing the mobile phone real-estate to support additional non-voice features.

The objective of this panel session is to compare the potential of each of these technologies to achieve size, weight and cost improvements. The participants will also discuss the relative merits and challenges these approaches offer in the area of design, manufacturing and test of integrated handset radios.