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IEEE Radio Frequency IC Symposium 2005
RFIC 2005
Workshop WSD

WSD: ADVANCED SYSTEM SOLUTIONS AND INTEGRATION TECHNOLOGIES FOR HIGH-VOLUME WIRELESS-LAN APPLICATIONS

Date & Time: Sunday, June 12; 8:00 AM to 5:00 PM
Location: Long Beach Convention Center, Room 101AB

Topics & Speakers:

  • MIMO WLAN Transceiver Concepts and its Implication on the FEM development, Avi Biran, Intel Corp
  • Ultra-Compact WLAN FEMs for the High-Volume Wireless Mobile Market, Patric Heide, EPCOS AG
  • RF Silicon Integrated Passives (RFIPDs) for WLAN Applications, C. H. Wang, Telephus
  • Laminate-Based RF Integrated Passive Frontend Devices for WLAN Application, J. Chamberlin, JMD
  • LTCC Front End Module for WLAN Application (IEEE 802.11a/b/g), S. Kemmochi, Hitachi Metals
  • Small-size WLAN integrated modules, K. K. Kano and K. Kato
  • FEMs for Mobile / Cellular Applications, B. Hemish and P. Huang, SiGe Semiconductor

Organizers:

Patric Heide, EPCOS AG,
Avi Biran, Intel Corporation,
Clemens Ruppel, EPCOS AG

Sponsors:

MTT-20: Wireless Communications
MTT-16: Microwave Systems
MTT-23: RF Integrated Circuits 2005 RFIC Symposium

The WLAN market demonstrated enormous growth rates in the last few years. Likewise the cellular phone market, the WLAN market has seen strong component cost reductions, with simultaneous increase in the complexity of WLAN radio transceivers - from single to multi-band / multimode solutions, coexistence with Bluetooth, novel cellular functions and, most recently - the realization of 802.11n and MIMO concepts. Apparently, the size of WLAN-radio transceiver RFIC and its adjacent FEM became a critical system-implementation factor. Wireless connectivity has become an embedded feature in mobile PCs, PDAs and smart phones, where, the number of functions per sq. mm is the limiting functionality factor. Very small WLAN RFICs with form factors compatible to CF and SD cards, memory sticks and USB-interfaces have been introduced in 2004. Highly-integrated FEM and single-chip radios have for the first time been applied to allow those innovative implementations. Most recently, the cellular industry has set the very challenging target of implementing a high-performance WLAN radio within 150 sq.mm (802.11g) and 250 sq.mm (802.11a + g) challenges. This will drive further the trend for higher integration levels, cost reduction, reliability and yield improvements.

Important Dates


RFIC 2005:
12-14 June, 2005


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