WSH:
Mixed Signal Design Methodology & Environment
Date & Time: Sunday, June 6; 8:00 AM
to 5:00 PM
Location: Fort Worth Convention Center, Room
204B
Topics & Speakers:
- Mixed signal IC and Module Design Flow; Present and Future,
Jyoti Mondal and Glenn Raskin,
Motorola.
- Mixed Signal IC Design Methodology; Presently Adopted
and Future Requirements,
Claire Jackoski and Jan Niehof,
Philips
- VHDL, A Mixed Signal Simulator for RF Systems Solutions,
Christian Münker, Infineon
- Integration of Circuit and System Analysis for 802.11
Applications,
Stephen Maas, Microwave Office
- NeoRF – A Real Time, Parasitic-Cognizant, RF Design
Methodology,
Aykut Dengi, Neolinear
- System to Circuit Level Design and Verification of a
Wireless LAN Example,
Tom Phillips, Agilent Technology
- An Integrated Environment for Mixed Signal IC and Module
Development,
Kurt Johnson, Cadence
- Design Trade-offs for Wireless Analog Baseband Circuits
in Nanometer CMOS,
Jerry Lin, Texas Instruments
- Top Level Mixed Signal IC Verification Using a Fast MOS
Solver,
Joe Pertu and Angelo Espinoza,
Synopsys
Organizer:
Jyoti Mondal, Motorola Semiconductors
Sponsors:
MTT-6: Microwave and Millimeter-Wave Integrated Circuits
MTT-7: Microwave and Millimeter-Wave Solid State Devices
MTT-16: Microwave Systems
MTT-23: RF Integrated Circuits
2004 RFIC Symposium
Today’s famous buzzwords are single chip radio and
system on a chip (SOC). There are some formidable design challenges
to overcome before these buzzwords become reality. The challenges
lie in multiple design environments and the top level verification
of a mixed signal IC. A conventional RF designer not only
has to have a sound knowledge in RF design, he needs to analyze
circuits from other domains in an integrated design environment.
The other domains include digital and analog. The digital
circuits include Serial Peripheral Interface (SPI) and other
control circuits for RF and analog blocks. The analog circuits
include biasing networks as well as base band circuits <
5MHz. After various circuit blocks are connected on an IC,
two issues need to be addressed: 1) top level verification
that checks the connectivity, and, 2) Co-simulation of all
the blocks in a single design environment that checks the
electrical specification of the IC.
Using some examples, this workshop will focus on the above
two issues in the mixed signal IC design environment. Design
tool vendors are working on various aspects of the issues
and developing new tools. The user community has started applying
these tools in the mixed signal IC designs.
This workshop will present the progress and status on the
tools by the vendors followed by examples from the user community
that has used these tools on mixed signal ICs.
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