WSA:
Wireless LAN Solutions and RF Front-End Integration Trends

• The Miniaturization of WLAN Subsystems and the Challenge it Imposes on the RF Front End Integration,
  Shemesh Yair and Avraham Biran, Intel Corp.
  
• Front-End Module Solutions and Integration Trends for High-Volume IEEE 802.11 a/b/g WLAN Applications,
  Patric Heide, EPCOS AG
  
• Packaging WLAN Solutions for Cost, Size and Performance,
  Doug Mathews, Amkor Technology
  
• A High Sensitivity, Small Form Factor and Low BOM WLAN 802.11a/g RF System Solution Using a 0.25um BiCMOS RF Transceiver and a SiGe Dual-band Power Amplifier, B.-U.
  Klepser, T. Ruehlicke, M. Zannoth, and W. Oesterreicher, Infineon Technologies AG
  
• Wireless LAN Modules: Design Considerations and Trade-offs,
  Neil Mellen, TDK
  
• Low-Cost WLAN Modules for Mobile Applications,
  TBD, muRata
  
• Overview on 802.11 Standardization and Coexistence implications in multi-wireless-standard environments,
  Oren Eliezer, Texas Instruments
  
• Single and Multi-Mode GaAs MMIC Power Amplifiers and Front-End Modules for 802.11a/b/g Applications,
  Yongxi Qian and Michael E. Kim, Microsemi Corp.
  
• WLAN Front-End Solutions,
  Mark Comerford, Skyworks Solutions
  
• Optimizing Performance, Form Factor, and Ease of Use with SiGe-based PAs and Front-End Modules,
  William Vaillancourt and Steve Kovacic, SiGe Semiconductor
  
• Power Amplifiers, LNAs and Modules for 802.11a/b/g,
  Kevin Gallagher, TriQuint Semiconductor
  
• Architecture and Advanced Design Methodologies for WLAN Front End Modules,
  Chun-Wen (Paul) Huang, Anadigics

Organizers:

Clemens Ruppel, EPCOS AG
Robert Weigel, University of Erlangen
Patric Heide, EPCOS AG

Sponsors:

MTT-6: Microwave and Millimeter-Wave Integrated Circuits
MTT-16: Microwave Systems
MTT-20: Wireless Communications
MTT-23: RF Integrated Circuits
2004 RFIC Symposium

The recent growth of Wireless-LAN applications is impressive both in terms of the quantities of units deployed and the number of companies working on WLAN products.

Current 1st generation products, mainly mini-PCI and PCMCIA cards, are using a large number of discrete RF components, but a strong move towards module solutions has started. Since WLAN is becoming a standard em­bedded feature of notebooks, PDAs, and even mobile phones, much smaller form factors like compact flash, SD card, memory stick and USB are becoming mandatory. The use of integrated front-end modules saves significant space, reduces the bill of materials and cuts cost due to improvements in yield, reliability, development time and logistics. Dual-Band/Tri-Mode 2.4 and 5 GHz WLAN systems and even more complex solutions combining WLAN with Bluetooth and cellular modes are gaining ground and will further increase the demand for miniaturization and modularization.

The availability of RF components is mainly fueled by technologies initially developed for very large volume applications in cellular phones. But for the upcoming novel WLAN module solutions, what is actually the right integration approach among a confusing long list of technology choices like system-on-chip, system-in-package, silicon, GaAs, LTCC, laminate and many others? And how can such innovative WLAN modules become standardized, non-single-source, production-mature products, which is a key factor for their success in high-volume markets?

This full-day WLAN workshop will include presentations from extraordinary speakers coming from different levels of the value chain, covering all the important aspects of WLAN systems like RF chipsets, multiband / multimode embedded solu­tions, front-end modules, packaging and integration technologies, PAs, switches, and passive components. One of the main goals of this workshop is to stimulate discussions and know-how exchange between the panelists and the audience, such that at the end of the day workshop participants will have developed a good understanding of what the trends are in the WLAN industry and which kind of integrated products we can expect down the road.